Gömülü - Tek Çip Sistem (SoC)
XCZU17EG-2FFVC1760E
IC SOC CORTEX-A53 1760FCBGA
- Üretici
- AMD Xilinx
- Paket/Kılıf
- 144-BGA
- Kategori
- Gömülü - Tek Çip Sistem (SoC)
Teknik Özellikler
| Parametre | Değer |
|---|---|
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Part Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| RAM Size | 256KB |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
Kaynaklar
Datasheet
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Pinout
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Eşdeğerler (Muadiller)
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